Contract

TECHNOLOGY/BUSINESS OPPORTUNITY Closed Loop Arbitrary Spatial Polarization Shaping (CLASPS)

Agency: ENERGY, DEPARTMENT OF / ENERGY, DEPARTMENT OF
Location: Livermore, CA
Amount: Amount not listed
Deadline: Closes in 26 days (Aug 13, 2026)
Posted: Jul 13, 2026
Set-aside: None (open competition)
NAICS code: 334413

What this contract is for

Opportunity: Lawrence Livermore National Laboratory (LLNL), operated by the Lawrence Livermore National Security (LLNS), LLC under contract no. DE-AC52-07NA27344 (Contract 44) with the U.S. Department of Energy (DOE), is offering the opportunity to enter into a collaboration to further develop and commercialize its Closed Loop Arbitrary Spatial Polarization Shaping (CLASPS). Background: High-energy and high-peak-power pulsed laser systems are enabling technologies for particle acceleration, nuclear fusion, additive manufacturing, defense and more. Newer laser systems continually push the limits of laser pulse energy and peak power to drive stronger laser-matter interactions. There is a pressing need for tighter customization of pulse shaping and tunable polarization in applications such as particle acceleration and coupling laser pulse energy to EUV source materials for increased yield of relevant particles/radiation. Description: Performance at bottlenecks of these high energy laser systems can be enhanced by careful manipulation of the laser pulse and laser beam qualities using CLASPS. This enables spatial phase and polarization laser shaping, which can address dynamic thermal birefringence and accumulation of other nonideal optical aberrations that make it difficult to control laser beam wavefronts. Advantages/Benefits: Much lower costs vs. deformable mirror wavefront shapers Much higher laser damage threshold wavefront shaping component technology Potential Applications: Polarization/Wavefront shaping for damage-free operation of IFE class laser drivers, high peak power laser based particle accelerators Key enabling technology for higher EUV photon yield EUV and beyond EUV laser drivers for high throughput semiconductor patterning and manufacture. Development Status...

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