Contract · Federal

Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies

Agency: DEPT OF DEFENSE / DEPT OF THE ARMY
Location: Nationwide
Amount: Amount not listed
Posted: Aug 18, 2026
Set-aside: None (open competition)
NAICS code: 541715 - Scientific Research and Development Services (general category) look up NAICS codes
PSC code: R425 - Professional, Administrative, and Management Support Services (general category)

Timeline

Posted

Aug 18, 2026
Status

Closing soon

What contracts like this typically pay

No award history yet for this category (NAICS 541715).

What this contract is for

Agency: DEPT OF DEFENSE / DEPT OF THE ARMY
Location: Nationwide
NAICS: 541715 - Scientific Research and Development Services (general category)
Scope: Federal

Information Requested: The U.S.

Army Combat Capabilities Development Command Aviation and Missile Center (DEVCOM AvMC), Redstone Arsenal, AL is conducting market research to identify domestic products, suppliers, designers and manufacturers of advanced protection architectures, systems, components, and other technologies for packaged microelectronics intended for deployment into current and future military systems of interest to the Department of Defense (DoD).

This RFI is seeking information from suitable vendors/vendor teams related to the following Technology Areas: 1.

Board-level Security: Capabilities spanning microelectronic components and portable soft IP integrated with commercial-off-the-shelf (COTS) devices across modular open systems architectures (MOSA) form factor systems (e.g., 3U/6U OpenVPX/SOSA, 3U/6U SpaceVPX, VNX, and smaller).

Package Security: Specialized microelectronics packaging configurations or designs for multi-chip modules (MCMs) or systems-in-package (SIPs) which utilize COTS or bespoke security components that are intended to provide additional security to underlying components.

Enhanced Secure Boot: Portable soft IP that can be used in conjunction with COTS microelectronic components to provide additional security for enhanced secure boot applications.

Secure Components: Purpose-designed microelectronic components (chiplets, ASICs, etc.) that are intended to provide enhanced trust/security for co-packaged microelectronic components.

Multi-chip Packaging: Advanced microelectronics packaging techniques that inherently provide additional component security or could be easily adapted to provide additional microelectronic component security.

Emerging Technologies: Novel techniques, materials, and processes that are compatible with modern micro...

Official solicitation and documents

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